PROBE MODULE TYPES
General Probe Module offers 3D probing for best test access	Camera Module for fiducial detections & optical inspection	LED Analyzer Module detects LED color and intensity	Barcode Reader Module reads board and component barcodes
LaserScan Module (50 mm range) profiles PCB warpage for active warp compensation	LaserScan Module (100 mm range) profiles PCB warpage for active warp compensation	C-Scan Prode Module offers vectorless testing of open pins on connectors & ICs	Thermoscan Camera Module for thermal analysis of components
Flying Oscilloscope Probe Module for automated oscilloscope probing, enhancing the accuracy and depth of testing electronic components.	Flying Fixture Module is a mini-fixture for bed-of-nails testing & high frequency measurements	Marker Module marks boards "Pass" or "Fail" based on the test outcome	RF Probe Module for high-speed digital and RF ATE production requirements.

From design validation to production testing, the exclusive probe module capabilities are distinct features of the Flying Scorpion's remarkable flexibility. External measurement instruments can utilize the system's robotic probing action to perform complex tests rapidly while maintaining high accuracy and precision. Resulting in substantial cost and time savings.

Advanced Probe Module Technology

Unmatched test point contact with Programmable Probe Angle - omni-directionally on the horizontal, and -6° to +6° on the vertical planes - the taller the parts present on the unit under test the more important variable angles become. Taller components can obstruct the path of the probes, making it difficult to access test points. By adjusting the angle at which the probes contact the PCB, you can ensure that they are contacting the intended test points, even if the PCB layout is complex or the test points are not easily accessible.

Programmable X, Y & Z axis - the adjustable range in the Z-axis is probing up to 42 mm for fly over and up to 85 mm for fly-around.

Programmable probe speed

Programmable “No-Fly Zones”

Field Oriented Control (FOC) - uses mathematical algorithms to determine the best way to move the probes to contact the test points on the PCB. The algorithm considers the position of the probes, the layout of the PCB, and the height of any components that may obstruct the path of the probes. This allows the FOC system to adjust the probe angles, speed, and trajectory in real-time, to ensure that the probes contact the correct test points, without damaging the PCB or the probes.

Double sided Probing - Faster test times & enhanced test coverage

Large Test Area - Test large boards & boards with tall components: 642x 1200 mm max board size

Automatic Board Handling - Production line integration with autonomous loading and unloading options

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Electrical Test & Inspection Capabilities

Analog Measurement

Passive Components, Shorts, BodeScan Test

Vectorless Testing

ChipScan, C-Scan

Boundary-Scan /JTAG

Test Interconnects & Clusters

Power-up, Functional & RF Testing

Power-up, Dynamic Digital & Analog tests

Device Programming

Ultra-Fast Device Programming

Ultra-Accurate Probing & Positioning System

1-micron minimum step size, +/-10 micron positioning repeatability

Closed-loop drives for shuttles and probe modules ensure precise and repeatable positioning of the probes. Riding on a 12-micron air gap, shuttles travel friction-free and without mechanical contact on the stator plane, thus operating without wear.

High-resolution fiducial detection cameras, precise lighting, and advanced image processing software ensure precise and repeatable detection of fiducial marks on the UUT, as well as correct compensation for any offsets. Once the camera system locates the board in the X and Y planes, the LaserScan module is used to complete the 3D contour map of the board in the Z-plane.

On-board Device Programming

The electronic measurement system relies on precision circuits and components for reliable and repeatable measurements.

Soft Touch Probing – The Integrator Pro™ system control software, with sophisticated motion control and measurement algorithms, ensures robust and repeatable operation.

What is the difference between a Flying Probe and an In-circuit tester?

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Flying probe and in-circuit testers (ICT) are used to test printed circuit board assemblies (PCBAs) to ensure quality and functionality.

However, they have some differences in operation, flexibility, and cost-effectiveness.

A flying probe tester is a fixtureless testing tool that utilizes multiple movable test probes to contact specific points on the PCB. It measures the electrical properties of components and checks for shorts, opens, or incorrect component values.

In-circuit testers use a custom test fixture, known as a "bed of nails," to make contact with test points on the PCB. In-circuit testers are generally more suitable for medium to large-scale production.

Flying Probe Testers - key points

No need for custom test fixtures: Flying probe testers do not require test fixtures, making them suitable for low to medium-volume production runs and ideal for prototyping and rapid design changes.
Flexibility: They can easily adapt to different PCB designs and test complex, dense boards.
Shorter setup time: generating test programs is usually quick, and Test programs can be updated to accommodate design changes, enabling faster testing turnaround and reducing production delays.
Lower operating cost: elimination of fixture costs reduces NRE costs, making flying probe testing more cost-effective for prototypes and small to medium production runs.

In-Circuit Testers - key points

Custom test fixtures: ICT uses custom test fixtures, often called "bed of nails," to contact test points on a circuit assembly.
Medium to high-volume production: Electronic manufacturers typically use ICT for medium to high-volume production.
High test speed: In-circuit testers can perform tests faster than flying probe testers, as they can access multiple test points simultaneously, making them suitable for high-volume production.
Higher initial cost/NRE: The custom test fixtures required for ICT can be expensive, especially for low-volume production or prototypes.
Longer test development time: Designing and manufacturing custom test fixtures can lead to more prolonged setup times.
Less flexibility: Any changes in the PCB design may require updates to the test fixture, increasing test preparation time and cost. This makes ICT less adaptable to frequent design changes than flying probe testers.

Production Test Challenges

Tight quality control measures and time-to-market pressures are compelling manufacturing companies to choose effective yet lean test and quality control strategies. Flying probe testers require no test fixtures, have few restrictions on board access, and can test boards with a virtually unlimited number of nets.

They also allow developers to complete test programs in a short time. With the SCORPION FLS980Dxi Flying Probe Tester, manufacturers can stay ahead of their competition and economically ensure product quality by catching defects before their customers do.

The Flexibility of the FLS 980Dxi

Flexibility-of-the-FLS-980Dxi

The Scorpion Flying Probe Tester is an effective testing solution that can be used throughout a circuit board's lifecycle. During the prototype testing phase, flying probe testers can quickly and accurately test small production runs, enabling engineers to identify and correct any issues before proceeding with full-scale production. In production testing, flying probe testers can provide high-speed and accurate testing for medium to high-volume production runs. And in repair depot testing, flying probe testers can help diagnose issues with boards that have failed in the field, minimizing downtime and reducing repair costs.

Flying Probe access to hard to access devices

Accessing hard-to-reach devices during in-circuit testing can be challenging due to PCB topography factors such as dense component placement, component height, small or fine-pitch devices. In many cases, a Flying Probe Tester is not limited by these access limitations, making it a powerful tool for production and prototype board testing.

SMD Device Leads

Test Pads, Vias, Thru-hole

Resistors, Caps., Diodes, Transistors

J-Lead Device Pins

Connector Pins, Tail & Tip

Passive Components

Resistors
Kelvin measurement
Kelvin measurement w/ two test points
Capacitors
Inductors
Diodes, Zener diodes
Transorbs
Transistors
FETs
Optocouplers
Thyristors
Triacs
Relays, precision relays relay timing
I-V / V-I curves
Voltage measurement
Current measurement

Network Analysis - BodeScan Test

Filter transfer functions
Quartz oscillators’ ability to oscillate
Presence of very small inductances & capacitances

Shorts

Power nets, proximity, adjacent, with reference to a net

Flying Probe Vectorless Test

The vectorless methods (Patented ChipScan technology & CScan) detect:

Open pin faults on ICs & BGAs including ungrounded metal caps and heat sinks

Connector pin faults - horizontal & perpendicular

Reversed electrolytic capacitors

Boundary Scan is very good at testing for IC shorts on nets that have boundary scan drivers, and it is also very good at detecting IC opens on boundary scan nets that have at least one boundary scan driver and one receiver. If memory devices are connected to scannable parts, they will also have boundary scan coverage.

Using a combination of digital boundary scan stimulus and analog flying probe voltage measurement can be used to test the functionality of certain types of circuits, such as A/D and D/A converters and voltage references.

Several sources can be used to power up a UUT inside the FLS980 tester. The ability to power up and flexibly control the UUT allows for functional block testing of onboard power generation circuits, operational amplifier circuits, and simple voltage tests. The UUT power supplies have standard current and voltage monitoring capabilities, which can be used to limit or sample board draws under different load conditions. This flexibility in powering the UUT allows for more extensive test coverage and can help ensure that the device or system being tested is functioning properly and meets the necessary specifications.

The Acculogic FLS980 Flying Prober enhances circuit board test and inspection capabilities with the introduction of the new Scorpion Bridge.

The Scorpion Bridge module enables test engineers to quickly boost their test coverage and design complete test cycles at the lowest cost.

How? The Scorpion Bridge provides the capability to connect 64 channels with individual testing capabilities to 64 probes on fully automated shuttles capable of on-the-fly transition from test to test with precision placement on the test location.

So, connecting a diverse range of external instruments (such as multimeters, signal generators, programmers, oscilloscopes, and more) to the FLS980 system is inexpensive and quick.

The FLS980Dxi flying probe tester can be combined with a variety of oscilloscopes to perform high-speed RF board testing.

Optical & Thermal Inspection Capabilities

AOI-Microscopy

Automated Optical Inspection & Microscopy

check for the presence, absence, orientation, and polarity of components

read 2D & 3D barcodes

LED test

check the hue, saturation, and intensity of SMT or edge-mounted LEDs

read 2D & 3D barcodes

Thermal profile verification

Flying Probe Test LaserScan

LaserScan allows the FLS980 to accurately locate and map a unit under test's (UUT) Z-height topography, so that the tester can automatically compensate for any board warping or thickness differences.

LaserScan will map the board's z-height in as many locations as the user requires, to accurately determine the position of the UUT to within +/- 50 micrometers in the z-axis. So, LaserScan prevents any probing inaccuracies resulting from board warpage.

Probe Module Types for Flying Probe Tester

Flying Fixture

A small Bed of Nails mounted on a shuttle is used for:

High current power up & functional test

High-frequency test applications

Flash programming

Fast Boundary Scan test

Other complex test applications

Scan Navigator

Integrator Project

Test program generation for the FLS980 test platform is highly automated, simple, and intuitive. The automatic test program generator and operating software (INTEGRATOR) manages all aspects of test program and moves you quickly from test program development to production test deployment.

INTEGRATOR includes: Acculogic's XMatic™ software, which automatically generates output files for most commercial In-Circuit, Flying Probe, Boundary Scan/JTAG testers, and AOI machines. With its user-guided nail/probe selection routine and complementary interactive tools, XMatic offers complete flexibility and control during fixture design and flying probe selection.

The FLS980DXi is an automated low-cost alternative to manual or semi-automated reverse engineering methods.

Intelligently maps board connectivity through probing pads on the board

Recreates netlist for test program generation

Generation of input data for test program development

Generation of electrical design data

Aides the design of a new revision board

Accessibility to both sides of the PCB

Fast learn process with multiple probing in one pass

Soft touch probing reduces wear on learned PCB contact points

Learn time reduction with increased probe count

Integrated software tools minimize processing time

Reverse Engineering

Probe Tip Types

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Item	Specification	Value [mm]
Fine Pitch Probe Tip*	Thickness at the tip: Length:	1 44.9
Ultrafine Pitch Probe Tip	Thickness at the tip: Length:	0.65 48.1
Low Force Rounded Tip	Thickness at the tip: Length:	0.65 46.9
Cup Probe Tip	Thickness at the tip: Length:	1 45.1
Standard Probe Tip	Thickness at the tip: Length:	1 45.1
Chisel Head	Thickness at the tip: Length:	1 46.9
RF Signal Probe Tip	2 Pin Head

*- Standard offering with FLS980Dxi system with 1.5N probing force*-Probes can come with different probing force including 0.6 N; 0.8; 1.5 N; 2.25; 3.0 N nominal values

Frequently Asked Questions

Is probing height on the FLS980 adjustable?

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Yes, probe height is adjustable on the fly through programming. This is verified during the setup phase of the initial program. LaserScan™ can also be utilized to verify component heights and PCB warpage, feeding back adjustment information to the probes. Programmable “No-Fly Zones” are possible also. The adjustable range in the Z-axis is probing up to 42mm for flyover and up to 85mm for fly-around.

How many top & bottom probe modules can be installed?

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The FLS980 offers double-sided probing and up to 22 probe modules on the component and solder side of the Unit Under Test (11 Top / 11 Bottom) to facilitate efficient single-pass testing.

Which software translates board design CAD data?

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Acculogic’s XMatic™ software is a fully integrated solution that allows users to transition from design to test and inspection quickly.

With its fast, user-guided nail/probe selection routine and complementary interactive tools, XMatic offers complete flexibility and control during fixture design and flying probe selection.

XMatic automatically generates output files for most commercial In-Circuit, Flying Probe, Boundary Scan/JTAG testers, and AOI machines.

Support for most commercial CAD formats, including GENCAD, IPC-356, and ODB++, just a few commonly used examples
Support for all popular ICT, MDA, Flying Probe, and X-Ray Systems
Net, graphics, and component information is automatically extracted from the CAD files
Support for both Gerber-D and Gerber-X formats.

Does the FLS980 have an in-line option?

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Yes, all systems come standard with a pass-through SMEMA compliant conveyor system.

Is there feedback to the system for probe height or board contact?

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Yes, this is critical in ensuring accuracy and repeatability, especially when board warpage affects the target location. The FLS980 utilizes a closed-loop control system, and the system's architecture guarantees repeatability. Closed-loop drives for shuttles and probe modules ensure the probes are positioned precisely and repeatably.
High-resolution fiducial detection cameras, precise lighting, and advanced image processing software guarantee accurate and repeatable detection of fiducial marks on the Unit Under Test and correct compensation for any offsets.
Once the camera system locates the board in the X and Y planes, the LaserScan Module is used to complete the 3D contour map of the board in the Z-plane.
The electronic measurement system relies on precision circuits and components for reliable and repeatable measurements.
Integrator Pro, the operating software system of the FLS980, with sophisticated motion control and measurement algorithms, ensures robust and repeatable operation.

Can the FLS980 perform test for reversed cap polarity?

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Yes, the tester can do this in 3 ways:

PolScan (sensor)
PoleTest (electrical contact)
Optically

How does the tester perform IC opens testing?

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1. ChipScan (Patented) - using the protection diodes built into the Digital IC parts. These limits are very user-programmable and limit the potential for device damage. As all the device power rails are defined, there is little change to stimulate at unsafe levels.

2. CScan - Capacitive Coupling setup using the standard test probes as sensors that hover over the bond wire. 200mV AC stim is placed on the net as the source.

3. Power Up Boundary Scan test driven by Acculogic's ScanNavigator.